BEGIN:VCALENDAR
VERSION:2.0
PRODID:www.isi.edu
METHOD:REQUEST
BEGIN:VEVENT
CREATED:20260928T133910
UID:7427
DTSTART:20261002T190000Z
DTEND:20261002T200000Z
SUMMARY:Advanced Thermal Management of 3D Semiconductor Chips and Packages: From External Cooling to High-Performance Thermal Materials Within the Package
LOCATION:https://usc.zoom.us/j/91332239377?pwd=Cln8k0OGSSzK3zkW0A8tTRXHk6EszT.1
UID:ISI7427
URL:https://www.isi.edu/events/7427/advanced-thermal-management-of-3d-semiconductor-chips-and-packages-from-external-cooling-to-high-performance-thermal-materials-within-the-package
DTSTAMP:20260928T145211Z
END:VEVENT
END:VCALENDAR