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     HOT Chips 10
     A Symposium on High-Performance Chip Architectures

     Stanford University, Stanford, California
     August, 1998

     CALL FOR CONTRIBUTIONS

     HOT CHIPS is presenting its tenth conference!
     Sponsored by the IEEE Computer Society Technical
     Committee on Microprocessors and Microcomputers, the
     HOT Chips 10 conference focuses on high-performance 
     chips, systems and related topics.

     The emphasis is on real products and real technology,
     at the system/chip level, not paper designs.
     
     Participants will not be required to prepare written papers.
     The proceedings will consist of copies of the slides presented.

     Contributions are solicited in the following areas:
     - RISC, CISC and VLIW Processors
     - 3-D Graphics and Multimedia Chips
     - Embedded CPUs, Chip Sets and DSP Chips
     - Special Function Chips (Encryption, Floating Point
        Processors, Compression)
     - Low Power Chips and Technologies
     - Intelligent and High Performance Memory Chips
     - Field Programmable and Reconfigurable Chips
     - Compilers and Binary Translators
     - Benchmarking/Performance Evaluation
     - New Technologies

     Proposals should consist of a title, an extended abstract (1-3 pages)
     describing the product or topic to be presented, and the name, title,
     address, phone number, fax number, and electronic mail address of the
     presenter.  You must advise us if you have an identical, similar or
     overlapping submission pending at another conference or for a journal.
     The status of the product or topic should be described precisely, e.g.
     "planned", "first silicon", "fully debugged", "sampling", "in quantity
     shipment" etc.  If this is a not-yet-announced product, and you would
     like the submission kept confidential, please indicate it; we will do
     our best to maintain confidentiality.  Authors will be notified of the
     status of their submission by late April, 1998.  Presentations will be
     selected based on the program committee's evaluation of interest to
     the audience; the committee will consider factors such as novelty,
     performance, advanced technology, commercial scope, technical
     content of the submission and significance.

     Submissions can be made by hard copy, fax, or electronic mail.
     Plain ASCII is preferred, PostScript acceptable, but no PC formats or
     compressed formats please! 

     Please submit papers no later than Monday, March 16, 1998, to:
     Prof. John Wawrzynek
     631 Soda Hall
     University of California - Berkeley
     Berkeley, CA  94720-1776
     [email protected]
     Phone (510) 643-9434
     FAX    (510) 642-5775

     For further information about submissions, contact:
     John Wawrzynek at the above address, or 
     Norman Jouppi at
     Digital Equipment Corporation
     250 University Ave.
     Palo Alto, CA 94301
     (650) 617-3305
     [email protected]

     General Chair:
     Allen Baum, Digital Equipment Corporation

     Program Co-Chairs:
     Norman Jouppi, Digital Equipment Corporation
     John Wawrzynek, University of California, Berkeley

     For HOT Chips 10 Updates:  http://www.hotchips.org