Gopi Neela

Modeling the Impact of TSVs on Average Wire Length in 3DICs Using a Tier-Level Hierarchical Approach

TitleModeling the Impact of TSVs on Average Wire Length in 3DICs Using a Tier-Level Hierarchical Approach
Publication TypeConference Paper
Year of Publication2014
AuthorsG. Neela, and J. Draper
Conference NameVLSI (ISVLSI), 2014 IEEE Computer Society Annual Symposium on
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