{"id":368,"date":"2024-05-13T19:25:08","date_gmt":"2024-05-13T19:25:08","guid":{"rendered":"https:\/\/www.isi.edu\/proxy-dreamsmicrochips\/?page_id=368"},"modified":"2026-02-12T00:33:03","modified_gmt":"2026-02-12T00:33:03","slug":"about-dreams-demo","status":"publish","type":"page","link":"https:\/\/www.isi.edu\/proxy-dreamsmicrochips\/","title":{"rendered":"About CA DREAMS"},"content":{"rendered":"\n\n\t<article id=\"about-dreams\">\n    <p>Led by the University of Southern California Information Sciences Institute (USC\/ISI), the Defense Ready Electronics and Microdevices Superhub (CA DREAMS) is one of eight regional innovation hubs established under the <a href=\"https:\/\/microelectronicscommons.org\" target=\"_blank\" rel=\"noreferrer noopener\">Microelectronics Commons<\/a> program. This strategic initiative is funded by the DoW to develop onshore microelectronics hardware prototyping.<\/p>\n    <p>CA DREAMS unites academic and commercial organizations across Southern California and our partners across the United States with three goals: maturation of advanced RF technologies for rapid prototyping, lab-to-fab transition of semiconductor technologies and training the next-generation of engineers in advanced RF and microelectronics technologies.<\/p>\n<p>The pioneering USC\/ISI MOSIS Multi Project Wafer (MPW) fabrication services is at the core of CA DREAMS. MOSIS is a transformative service that has streamlined the end-to-end prototyping of microchips for educational, commercial and national security applications for over 40 years. MOSIS 2.0 connects customers to an extensive network of state-of-the-art nanofab and foundry services, accelerating the use of advanced process and prototyping technologies within the CA DREAMS hub, and reducing barriers to innovation.<\/p>\n<\/article>\n        <h2>Unique Capabilities<\/h2>\n                <ul>\n                    <li>MOSIS 2.0, the next chapter of a groundbreaking semiconductor fabrication service established at USC&#8217;s Information Sciences Institute in 1981, is the sole customer-focused prototyping platform within the Microelectronics Commons.<\/li>\n                    <li>DREAMS wields unprecedented RF prototyping capabilities with over 200 of the nation&#8217;s top RF researchers and innovators to address the full scope of advanced RF prototyping for commercial and national security applications. These Industry pioneers, who launched the compound semiconductor revolution in gallium arsenide (GaAs), gallium nitride (GaN), indium phosphide (InP) and beyond, are at the core of the DREAMS team.<\/li>\n                    <li>The DREAMS workflow has been uniquely designed to enable accelerated prototyping with prototype process modules in two weeks; full-flow wafers in eight weeks; and RF system brassboards in 12 months. <\/li>\n                <\/ul>\n                <dl>\n                    <dt>$27<\/dt>\n                    <dd>million first year funding<\/dd>\n                    <dt>16+<\/dt>\n                    <dd>partners<\/dd>\n                    <dt>50+<\/dt>\n                    <dd>affiliates<\/dd>\n                    <dt>7<\/dt>\n                    <dd>University Nanofab Laboratories<\/dd>\n                    <dt>3<\/dt>\n                    <dd>DOD-volume fab facilities<\/dd>\n                <\/dl>\n\t<h2>LATEST NEWS<\/h2>\n<div class=\"news-widget row\"><article class=\"news-item col-12 col-md-6 col-lg-4 pb-5\">\n                            <a href=\"https:\/\/www.isi.edu\/news\/972950\/mosis-2-0-and-globalfoundries-partnership-a-strategic-alliance-for-semiconductor-innovation\/\" target=\"_blank\" class=\"d-block news-photo\"><figure><img loading=\"lazy\" decoding=\"async\" width=\"1200\" height=\"800\" src=\"https:\/\/www.isi.edu\/proxy-dreamsmicrochips\/wp-content\/uploads\/sites\/49\/2026\/06\/FinalGF-Singapore-Cleanroom-135-2026.jpg\" class=\"attachment-post-thumbnail size-post-thumbnail wp-post-image\" alt=\"GlobalFoundries Singapore Cleanroom\" srcset=\"https:\/\/www.isi.edu\/proxy-dreamsmicrochips\/wp-content\/uploads\/sites\/49\/2026\/06\/FinalGF-Singapore-Cleanroom-135-2026.jpg 1200w, https:\/\/www.isi.edu\/proxy-dreamsmicrochips\/wp-content\/uploads\/sites\/49\/2026\/06\/FinalGF-Singapore-Cleanroom-135-2026-300x200.jpg 300w, https:\/\/www.isi.edu\/proxy-dreamsmicrochips\/wp-content\/uploads\/sites\/49\/2026\/06\/FinalGF-Singapore-Cleanroom-135-2026-1024x683.jpg 1024w, https:\/\/www.isi.edu\/proxy-dreamsmicrochips\/wp-content\/uploads\/sites\/49\/2026\/06\/FinalGF-Singapore-Cleanroom-135-2026-768x512.jpg 768w\" sizes=\"auto, (max-width: 1200px) 100vw, 1200px\" \/><\/figure><h3 class=\"no-tail my-4\">MOSIS 2.0 and GlobalFoundries Partnership: A Strategic Alliance for Semiconductor Innovation<i class=\"fas fa-external-link\" aria-hidden=\"true\"><\/i><\/h3><\/a>\n                        <p><p>In a move that promises to broaden access to U.S.-based chip manufacturing, MOSIS 2.0 has signed a value-added partner agreement with GlobalFoundries (GF), one of the world&#8217;s largest semiconductor manufacturers, creating a powerful synergy between the two industry partners.<\/p>\n<\/p>\n\t\t\t\t\t<\/article><article class=\"news-item col-12 col-md-6 col-lg-4 pb-5\">\n                            <a href=\"https:\/\/news.northropgrumman.com\/microelectronics\/accelerating-technology-new-gan-chip-for-department-of-war-delivers-on-performance-in-record-time\" target=\"_blank\" class=\"d-block news-photo\"><figure><img loading=\"lazy\" decoding=\"async\" width=\"1200\" height=\"800\" src=\"https:\/\/www.isi.edu\/proxy-dreamsmicrochips\/wp-content\/uploads\/sites\/49\/2026\/06\/Northrop-Grumman-high-frequency-Gallium-Nitride-chip.png\" class=\"attachment-post-thumbnail size-post-thumbnail wp-post-image\" alt=\"Northrop Grumman high-frequency Gallium Nitride chip\" srcset=\"https:\/\/www.isi.edu\/proxy-dreamsmicrochips\/wp-content\/uploads\/sites\/49\/2026\/06\/Northrop-Grumman-high-frequency-Gallium-Nitride-chip.png 1200w, https:\/\/www.isi.edu\/proxy-dreamsmicrochips\/wp-content\/uploads\/sites\/49\/2026\/06\/Northrop-Grumman-high-frequency-Gallium-Nitride-chip-300x200.png 300w, https:\/\/www.isi.edu\/proxy-dreamsmicrochips\/wp-content\/uploads\/sites\/49\/2026\/06\/Northrop-Grumman-high-frequency-Gallium-Nitride-chip-1024x683.png 1024w, https:\/\/www.isi.edu\/proxy-dreamsmicrochips\/wp-content\/uploads\/sites\/49\/2026\/06\/Northrop-Grumman-high-frequency-Gallium-Nitride-chip-768x512.png 768w\" sizes=\"auto, (max-width: 1200px) 100vw, 1200px\" \/><\/figure><h3 class=\"no-tail my-4\">GaN Chip Developed Through CA DREAMS Delivers on Performance in Record Time<i class=\"fas fa-external-link\" aria-hidden=\"true\"><\/i><\/h3><\/a>\n                        <p>Northrop Grumman has developed a breakthrough GaN chip and brought it to market in under six months. The project was supported through California DREAMS and the DoW Microelectronics Commons.\u00a0<\/p>\n\t\t\t\t\t<\/article><article class=\"news-item col-12 col-md-6 col-lg-4 pb-5\">\n                            <a href=\"https:\/\/www.isi.edu\/news\/972944\/ca-dreams-and-northrop-grumman-push-semiconductor-projects-into-high-gear\/\" target=\"_blank\" class=\"d-block news-photo\"><figure><img loading=\"lazy\" decoding=\"async\" width=\"1200\" height=\"800\" src=\"https:\/\/www.isi.edu\/proxy-dreamsmicrochips\/wp-content\/uploads\/sites\/49\/2026\/06\/ChatGPT-Image-Jun-2-2026-04_49_52-PM.png\" class=\"attachment-post-thumbnail size-post-thumbnail wp-post-image\" alt=\"Semiconductor Wafer\" srcset=\"https:\/\/www.isi.edu\/proxy-dreamsmicrochips\/wp-content\/uploads\/sites\/49\/2026\/06\/ChatGPT-Image-Jun-2-2026-04_49_52-PM.png 1200w, https:\/\/www.isi.edu\/proxy-dreamsmicrochips\/wp-content\/uploads\/sites\/49\/2026\/06\/ChatGPT-Image-Jun-2-2026-04_49_52-PM-300x200.png 300w, https:\/\/www.isi.edu\/proxy-dreamsmicrochips\/wp-content\/uploads\/sites\/49\/2026\/06\/ChatGPT-Image-Jun-2-2026-04_49_52-PM-1024x683.png 1024w, https:\/\/www.isi.edu\/proxy-dreamsmicrochips\/wp-content\/uploads\/sites\/49\/2026\/06\/ChatGPT-Image-Jun-2-2026-04_49_52-PM-768x512.png 768w\" sizes=\"auto, (max-width: 1200px) 100vw, 1200px\" \/><\/figure><h3 class=\"no-tail my-4\">CA DREAMS and Northrop Grumman Push Semiconductor Projects into High Gear<i class=\"fas fa-external-link\" aria-hidden=\"true\"><\/i><\/h3><\/a>\n                        <p>The latest phase of two major projects to advance chip technology aims to raise the bar to best-in-the-world performance.<\/p>\n\t\t\t\t\t<\/article>\n\t\t<\/div><!-- current news container -->\n\t\t\t<div class=\"cta-all-news text-center\">\n\t\t\t\t<a href=\"https:\/\/www.isi.edu\/proxy-dreamsmicrochips\/about\/news\/\" class=\"btn\">View All News<\/a>\n\t\t\t<\/div>\n                <h2>TECHNOLOGY AREAS<\/h2>\n                <ul>\n                    <li>DREAMS provides advanced RF prototyping across the full electromagnetic spectrum using state-of-the-art compound semiconductor materials, augmented with photonics and advanced CMOS technology.\n                    <\/li>\n                    <li>DREAMS hosts a range of technologies to improve RF system linearity and dynamic range through the integration of state-of-the-art circuit and mixed signal architectures, including heterogeneously integrated low phase noise oscillators, amplifiers with supporting precision metrology, ultra-low phase noise electronic and laser clocks that operate well over 100 GHz, and digitization (sampling and conversion) at the fundamental thermodynamic limits.\n                    <\/li>\n                    <li>DREAMS provides a range of technologies to support multi-sensor and integrated multifunction prototypes, including the integration of GaN for the RF front end, Si CMOS for direct RF sampling ADCs\/DACs, and Si-photonics for power-efficient high-rate data communications.\n                    <\/li>\n                <\/ul>\n                <a href=\"https:\/\/www.isi.edu\/proxy-dreamsmicrochips\/prototyping-capabilities\/\">learn more<\/a>\n                <h2>Work with us<\/h2>\n                <p>Interested in working with us on the future of advanced RF microelectronics? DREAMS is seeking partners, suppliers, and project participants with expertise in advanced RF technology.  We are also seeking external clients looking for access to the most advanced RF capabilities for their applications. Please contact us.  <\/p>\n                <a href=\"https:\/\/www.isi.edu\/proxy-dreamsmicrochips\/contact\/?topic=mosis\">Contact Us<\/a>\n\n","protected":false},"excerpt":{"rendered":"<p>Led by the University of Southern California Information Sciences Institute (USC\/ISI), the Defense Ready Electronics and Microdevices Superhub (CA DREAMS) is one of eight regional innovation hubs established under the Microelectronics Commons program. This strategic initiative is funded by the DoW to develop onshore microelectronics hardware prototyping. CA DREAMS unites academic and commercial organizations across&hellip;<\/p>\n","protected":false},"author":421,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"tpl-full-width.php","meta":{"news_source":"","news_author":"","external_news_link":"","footnotes":""},"class_list":["post-368","page","type-page","status-publish","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.0 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>About CA DREAMS - CA DREAMS<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.isi.edu\/proxy-dreamsmicrochips\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"About CA DREAMS - CA DREAMS\" \/>\n<meta property=\"og:description\" content=\"Led by the University of Southern California Information Sciences Institute (USC\/ISI), the Defense Ready Electronics and Microdevices Superhub (CA DREAMS) is one of eight regional innovation hubs established under the Microelectronics Commons program. This strategic initiative is funded by the DoW to develop onshore microelectronics hardware prototyping. 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