Event Details
April 17, 2026
Join Zoom Webinar
Passcode: 862998
Host: Steve Crago
POC: Amy Kasmir
While Micross has been in existence for over 45 years serving the Hi-Rel microelectronics market, the technical capabilities within the Micross family have grown substantially, organically and inorganically. This presentation will provide a brief introduction to Micross, then focus on its post CMOS wafer processing, assembly, and test capabilities, including an update on Micross’ 300mm wafer bumping and wafer finishing line investment funded by the IBAS RESHAPE program.
Speaker Bio
John Lannon is the General Manager of Micross Advanced Interconnect Technology. He received a BS in Physics from West Virginia University (WVU) in 1991, and PhD in Physics from WVU in 1996. With a background in thin film deposition and characterization, John has worked on the fabrication and improvement of resistive IR emitter devices (a MEMS-like device) for Infrared Scene Projectors for over 20 years. Beginning in 2005, he assisted with the development of high density interconnects (sub-20 µm pitch) for die stacking and detector hybridization, as well as the development of wafer-level vacuum packaging (WLVP) for MEMS devices. Currently, he continues to focus on the development and implementation of 3D integration and advanced packaging technologies (flip-chip bumping, high density interconnect bonding, WLVP, through-Si vias (TSV), through glass via (TGV), Si interposers, etc.) for government and commercial applications, as well as the development of novel 3D microstructures. In 2024, John received the William D. Ashman-John A. Wagnon Technical Achievement award from IMAPS for his contributions to IMAPS wokshops and publications, as well as the advanced packaging community. He serves on the organizing committee for the SMTA WLP Symposium (formerly IWLPC). John is also an active member of AVS, having served on various AVS committees since 2001 (Short Course, Education, Mid-Atlantic Chapter, Manufacturing Science and Technology Group, Strategic Planning) and currently chairing the newly formed Advanced Packaging Focus Topic committee for the 2026 AVS International Symposium (AVS 72)
