Toward Fine-Grained Heterogeneous Computing
The semiconductor process is a technology that has been well-established over the years. However, the increase in computing demand has necessitated exploration of various integration approaches such as 2.5D and 3D.
At ASIC Lab, we focus on heterogenous and monolithic integration and backend design of emerging logic/memory technologies for enabling novel circuit and system architectures. Our expertise spans across circuit design, floor planning, chip layout, tapeout and post-silicon verification. We collaborate with advanced semiconductor foundries as well as the USC cleanroom.