Completed Projects
A sampling of current and former R&D projects and federal agency sponsors:
- DARPA Expose – 3D chip inspection techniques using high resolution x-ray tomography; first project of its kind
- DARPA TAG – integrated circuit (IC) trust exploration; black hat team develops benchmark hardware Trojans and analyzes white hat capabilities
- AFRL SPAoA – AFRL consultant on development of a level 5 secure processor
- DARPA TERCI – Novel, efficient methods to identify IC reliability tampering
- DARPA ITAG – IC integrity and reliability vulnerability analysis and benchmarking under DARPA IRIS program; Techniques for FPGA counterfeit detection and functional discovery of hidden IP
- IARPA TIC – Split manufacturing strategy to create secure ICs at foreign SOA fabs
- IARPA SAFIRE – Novel anti-tampering methods focused on FPGA devices
- AFRL NWL – Electromagnetic emissions assessment from commercial devices
- DARPA HAVoC – Adversarial challenge team for FPGA firmware security vetting
- NASA SpaceCubeX, A-OPSS, FTS-3, and RHINO – Four generations of radiation hardening by software techniques; projects investigate FPGAs, including hard IP and on-board solutions
- DTRA RadMAC – Low-overhead error detection and correction via residue coding theory
