Inside a Chip

Volume Rendering of Integrated Circuit in 90nm Technology Using x-ray Computer Tomography

  • Area shown: 10um x 10um
  • Layers visible: Contact layer through Metal 3
  • Produced by University of Southern California Information Sciences Institute using Xradia x-ray microscope at Stanford Synchrotron Radiation Laboratory

Approved for public release; distribution unlimited

This work was sponsored by Defense Advanced Research Projects Agency Microsystems Technology Office (MTO). Program "Enhancing trust X-ray Phase-Optimized Scanning Equipment (EXPOSE) ARPA Order No. X040/07 Program Code: 7720 Issued by DARPA/CMO under Contract No. HR0011-07-C-0102.

Virtual De-layering of an IC

Virtual Delayering of Integrated Circuit in 90nm Technology Using x-ray Computed Tomography

  • Area shown: 10um x 10um x ~ 8 um height
  • Layers visible: Contact layer through Metal 9
  • Produced by University of Southern California Information Sciences Institute using Xradia x-ray microscope at Stanford Synchrotron Radiation Laboratory

Approved for public release; distribution unlimited

This work was sponsored by Defense Advanced Research Projects Agency Microsystems Technology Office (MTO). Program "Enhancing trust X-ray Phase-Optimized Scanning Equipment (EXPOSE) ARPA Order No. X040/07 Program Code: 7720 Issued by DARPA/CMO under Contract No. HR0011-07-C-0102.