Event Details

November 6, 2026

Join Zoom Webinar

Host: Steve Crago
POC: Amy Kasmir

As 3D advanced packaging pushes integration, miniaturization, and heterogeneous architectures, conventional inspection methods face growing challenges in detecting and characterizing defects within increasingly complex structures. Non-destructive techniques such as Scanning Acoustic Microscopy (SAM) and 3D X-ray imaging provide critical insights, but each has limitations in resolution, contrast, and defect sensitivity. Artificial intelligence and machine learning offer new opportunities to enhance inspection through automated defect detection, classification, segmentation, and quantitative analysis. Furthermore, multimodal data fusion can combine complementary information from acoustic, X-ray, and other characterization techniques to provide a more comprehensive understanding of materials, interfaces, and defects. This presentation will explore the evolving inspection landscape for next-generation 3D packages, the limitations of current approaches, and how AI-driven multimodal inspection can enable faster, more accurate, and more comprehensive reliability assessment and failure analysis.

Speaker Bio

Navid Asadi is an Associate Professor in the Department of Electrical and Computer Engineering at the University of Florida, with an affiliation with the Department of Materials Science and Engineering. His research focuses on electronics inspection, metrology, failure analysis, and assurance, as well as system- and chip-level decomposition, anti-reverse engineering, 3D imaging, invasive and semi-invasive analysis, and electronics supply chain security. Dr. Asadi is the Director of the Security and Assurance (SCAN) Laboratory at the University of Florida, which houses more than $20 million in advanced imaging, inspection, and characterization equipment. He also serves as Associate Director of the Florida Semiconductor Institute (FSI). Dr. Asadi has authored more than 250 peer-reviewed publications, holds 20 patents, and has three published books. He received the NSF CAREER Award in 2022 and several best paper awards from IEEE ECTC, SMTA International, and ASME ISFA. His other honors include the D.E. Crow Innovation Award, the University of Florida ECE Research Excellence Award, and a College Graduate Mentorship Award. He is the founder and General Chair of the IEEE Physical Assurance and Inspection of Electronics (PAINE) Conference. His research is supported by government agencies and industry partners, including NSF, AFRL, AFOSR, ONR, SRC, Meta, Cisco, and Analog Devices.