Abstract

BACKGROUND
Manufacturing of integrated circuit (IC) devices intro-25 duces distortions in the circuits of the devices. FIG. 1 shows a comparison between drawn design data 102 and resulting manufacturing variations 104 on a manufactured chip under the prior art. This comparison shows the impact of manufac turing variations on a design by showing the drawn design 30 data 102 and the corresponding image 104 obtained on Sili con after manufacturing. It is evident from a comparison of this drawn design data 102 and the resulting images 104 on Silicon that shapes are distorted during the manufacturing process. These shape distortions can cause the circuit corre-35 sponding to the design to behave differently than expected when embodied on Silicon. If these manufacturing variations can be captured during the design analysis phase, there is increased predictability of design behavior and consequently an …

Date

2010

Authors

H Chen, LF Chang, R Rouse, N Verghese

Inventors

Haizhou Chen, Li-Fu Chang, Richard Rouse, Nishath Verghese

Patent_office

US

Patent_number

7673260

Application_number

11586827