Abstract

The present disclosure generally relates to structures for use in optoelectronic/photonic applications and integrated cir cuit (IC) chips. The present disclosure also relates to semi conductor devices having a photodetector coupled with a waveguide, more particularly, a photodetector with a butt end coupled waveguide. The present disclosure provides a structure having a substrate, a photodetector arranged above the substrate, the photodetector having a core body and a coupler that is adjacent to the core body, in which the core body is configured to absorb light received by the coupler, and the coupler including a plurality of grating structures having respective widths that vary as a function of position relative to the core body.

Date

November 8, 2022

Authors

Y Bian, AP Jacob

Inventors

Yusheng Bian, Ajey Poovannummoottil Jacob

Patent_office

US

Patent_number

11495700

Application_number

16798417