Abstract

The present disclosure generally relates to semiconductor detectors for use in optoelectronic/photonic devices and integrated circuit (IC) chips, and methods for forming same. The present disclosure also relates to photodetectors inte grated with waveguide stacks, more particularly, photode tectors with butt-end coupled waveguides. The present dis closure also relates to methods of forming such structures. 20 Claims, 19 Drawing Sheets

Date

2021

Authors

Y Bian, AP Jacob

Inventors

Yusheng Bian, Ajey Poovannummoottil Jacob

Patent_office

US

Patent_number

10910503

Application_number

16544866