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IBM’s Technology Leadership Services organization includes the IBM Semiconductors Division, which is responsible for driving innovation in semiconductor technology for the future of computing. Many of the industry’s most significant breakthroughs—ranging from copper interconnects to the first 2‑nanometer node chip—have originated in IBM research laboratories and through collaboration with leading academic and industry partners. Following the divestiture of IBM’s fabrication facilities, IBM now operates as a fabless organization, partnering with several major foundries while maintaining multiple in‑house prototyping capabilities across North America. In Canada, IBM operates an advanced semiconductor packaging, assembly, and test facility, enabling the company to nurture a complete ecosystem for microelectronics technology development and refinement. IBM has a long and successful history of collaboration with the U.S. Department of Defense (DoD) and the Defense Advanced Research Projects Agency (DARPA), contributing to strategic national semiconductor initiatives.

At IBM’s in‑house assembly and test facility in Bromont, the world’s most advanced semiconductors are assembled into state‑of‑the‑art microelectronic components used in IBM systems as well as products manufactured by external customers. The site’s engineering organization brings deep expertise in advanced packaging, heterogeneous integration, and photonics for high‑performance computing and data‑center applications. With a proven track record in R&D, process development, and cross‑functional program execution, IBM supports the design and packaging of next‑generation optical interconnect systems. This includes materials science innovation for high‑reliability applications and manufacturing solutions enabling scalable, cost‑effective photonic integration. IBM Bromont is currently expanding its capabilities to include High‑Density Interconnect (HDI) technologies—such as bridge‑based integration using high‑density organic interposers and advanced laminate substrates—as well as high‑volume photonic assembly in a Class 100 cleanroom. The site is also integrating 2.5D and 3D wafer‑level packaging technologies transferred from IBM’s Albany R&D center. In addition, IBM has announced a phased expansion to support 300‑mm post‑CMOS processing, including 300‑mm bumping, wafer finishing, and molded package interposer technology. This expansion introduces more than 100 automated high‑volume 300‑mm manufacturing tools and provides capacity for both prototyping and large‑scale manufacturing on a lease basis for partners.

The workforce at IBM Bromont is globally recognized for its expertise, technical excellence, and commitment to customer success. The facility has remained a leader in a highly competitive and rapidly evolving market. Many of today’s internet and digital‑application experiences rely on assembly methods pioneered at IBM, and the company continues to push the boundaries of semiconductor packaging integration. IBM Bromont specializes in high‑volume, high‑mix, and high‑complexity packaging—including photonic modules—optimized to deliver differentiation and performance. The site is supported by world‑class laboratory capabilities, including failure analysis, electrical characterization and measurement, materials analysis, and advanced packaging reliability testing. IBM also invests heavily in a fully qualified supplier ecosystem with comprehensive traceability, marking, and supply‑chain management. IBM is a founding member of the Centre de Collaboration MiQro Innovation (C2MI), alongside the Université de Sherbrooke and Teledyne DALSA. This facility provides dedicated development lines that accelerate the advancement and commercialization of components critical to next‑generation technologies by leveraging a collaborative ecosystem, world‑class infrastructure, and combined industrial and academic expertise. This ecosystem also supports the training of the next generation of highly skilled professionals in the microelectronics and packaging fields. IBM Bromont is a corporate leader driven by the strength of its people and its technical mastery of quality, precision, and rapid transition from development to production. Operating 24 hours a day, 365 days a year, the site manufactures several hundred thousand microelectronic modules each week.