Abstract

We propose a ‘TSV-free’ solution to create three-dimensional (3D) silicon photonic (SiPh) components and interconnects based on phase matching. The evanescent coupling between interlevel optical stacks is comprehensively studied and leveraged to achieve flexible light control and realize hetero-stack communication in a monolithic SiPh platform. Various 3D functional photonic components, such as polarizers, polarization splitters and electro-absorption modulators are proposed and investigated. The TSV-free 3D optical interconnect provides a promising path towards low-cost, high-density SiPh chips for both monolithic and hybrid platforms, and potentially enables applications in a wide variety of fields such as LiDAR, artificial intelligence and optical biosensors.

Date

2021

Authors

Yusheng Bian, Ajey Jacob, Michal Rakowski, Ryan Sporer, Takako Hirokawa, Won Suk Lee, Asif Chowdhury, Abu Thomas, Bo Peng, Abdelsalam Aboketaf, Javier Ayala, Rod Augur, Ken Giewont, John Pellerin

Conference

2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

Pages

2279-2284

Publisher

IEEE