Abstract

A hybrid laser attach technology was demonstrated on GLOBALFOUNDRIES 300-mm monolithic silicon photonics (SiPh) platform. High accuracy bonding of laser inside a cavity in the SiPh die was accomplished. Optical power up to 10dBm was demonstrated through direct butt-coupling of the laser to SiPh die.

Date

2020

Authors

Yusheng Bian, Koushik Ramachandran, Bo Peng, Brittany Hedrick, Keith Donegan, Jorge Lubguban, Benjamin Fasano, Armand Rundquist, Jim Pape, Asli Sahin, Thomas Houghton, Karen Nummy, Jay Steffes, Louis Medina, Subharup Gupta Roy, Harry Cox, Bart Green, Kevin Dezfulian, Won Suk Lee, Andy Stricker, Kate Mclean, Shuren Hu, Zoey Sowinski, Colleen Meagher, Abdelsalam Aboketaf, Michal Rakowski, Mai Randall, Ian Melville, Dave Riggs, Ajey Jacob, Rod Augur, Daniel Berger, Anthony Yu, Ken Giewont, John Pellerin

Conference

2020 IEEE Photonics Conference (IPC)

Pages

1-2

Publisher

IEEE