Abstract

The present disclosure relates to semiconductor structures and, more particularly, to three dimensional (3D) optical interconnect structures and methods of manufacture. The structure includes: a first structure having a grating coupler and a first optical waveguide structure; and a second struc ture having a second optical waveguide structure in align ment with the first optical waveguide structure and which has a modal effective index that matches to the first optical wa ide structure.

Date

2020

Authors

AP Jacob, A Thomas, Y Bian

Inventors

Ajey Poovannummoottil Jacob, Abu Thomas, Yusheng Bian

Patent_office

US

Patent_number

10690845

Application_number

16298354