Publications

Methods of forming NMOS and PMOS finFET devices and the resulting product

Abstract

A device includes an NMOS FinFET device including a first fin. The first fin includes a first strain relaxed buffer layer doped with carbon and a first channel semiconductor mate rial formed above the carbon-doped strain relaxed buffer layer. A PMOS FinFET device includes a second fin. The second fin includes a second strain relaxed buffer layer and a second channel semiconductor material formed above the carbon-doped strain relaxed buffer layer. A first gate struc ture is positioned around a portion of the NMOS fin. A second gate structure is positioned around a portion of the PMOS fin.

Date
2018
Authors
AP Jacob
Inventors
Ajey Poovannummoottil Jacob
Patent_office
US
Patent_number
10056300
Application_number
15729051