Abstract

BACKGROUND FIGS. 5 and 6 show structures and respective fabrication 10 processes in accordance with additional aspects of the Integrated Si photonics is seen as a promising emerging present disclosure. pre technology to meet the industry imperative to reduce energy FIG. 7 shows structures and respective fabrication pro dissipated/bit for data transfer. A common integrated tech cesses in accordance with yet additional aspects of the nology for Si photonics uses Si waveguides, formed on deep present disclosure. BOX SOI (buried oxide in silicon on insulator technology) 15 FIG. 8 shows structures and respective fabrication pro (2 um thick) and cladded or encapsulated with SiO,. A c esses in accordance with still additional aspects of the common device used with Si photonics is the micro-ring, present disclosure. which can be used for modulators, ADD/drop filters, and FIG. 9 shows structures and respective …

Date

2018

Authors

RA Augur, AP Jacob, SM Shank

Inventors

Roderick A Augur, Ajey Poovannummoottil Jacob, Steven M Shank

Patent_office

US

Patent_number

9864132

Application_number

15282320