Publications

Scaling challenges for advanced CMOS devices

Abstract

The economic health of the semiconductor industry requires substantial scaling of chip power, performance, and area with every new technology node that is ramped into manufacturing in two year intervals. With no direct physical link to any particular design dimensions, industry wide the technology node names are chosen to reflect the roughly 70% scaling of linear dimensions necessary to enable the doubling of transistor density predicted by Moore’s law and typically progress as 22nm, 14nm, 10nm, 7nm, 5nm, 3nm etc. At the time of this writing, the most advanced technology node in volume manufacturing is the 14nm node with the 7nm node in advanced development and 5nm in early exploration. The technology challenges to reach thus far have not been trivial. This review addresses the past innovation in response to the device challenges and discusses in-depth the integration challenges associated with the …

Date
2017
Authors
Ajey P Jacob, Ruilong Xie, Min Gyu Sung, Lars Liebmann, Rinus TP Lee, Bill Taylor
Journal
International Journal of High Speed Electronics and Systems
Volume
26
Issue
01n02
Pages
1740001
Publisher
World Scientific Publishing Company