Publications

Methods of forming isolated fins for a FinFET semiconductor device with alternative channel materials

Abstract

One illustrative method disclosed herein includes, among other things, oxidizing a lower portion of an initial fin struc ture to thereby define an isolation region that vertically sepa rates an upper portion of the initial fin structure from a semi conducting Substrate, performing a recess etching process to remove a portion of the upper portion of the initial fin struc ture so as to define a recessed fin portion, forming a replace ment fin on the recessed fin portion so as to define a final fin structure comprised of the replacement fin and the recessed fin portion, and forming a gate structure around at least a portion of the replacement fin.

Date
2015
Authors
AP Jacob, MK Akarvardar
Inventors
Ajey Poovannummoottil Jacob, Murat Kerem Akarvardar
Patent_office
US
Patent_number
9147616
Application_number
14471087