Publications

Quantum sensor interposer packaging (qsip) with smart grid monitoring

Abstract

Provided is an interposer comprising: one or more photonic waveguide; one or more microwave circuit; one or more optical interconnect; and one or more electronic interconnect, further configured to support a quantum sensor, and methods of operating and fabricating thereof. Further provided is a the interposer containing one or more classical sensors. Further provided is a network of quantum sensors supported by said interposers.

Date
2026
Authors
AP Jacob, S Sunder
Inventors
Ajey Poovannummoottil Jacob, Sugeet Sunder
Patent_office
US
Application_number
19033302