Publications
Quantum sensor interposer packaging (qsip) with smart grid monitoring
Abstract
Provided is an interposer comprising: one or more photonic waveguide; one or more microwave circuit; one or more optical interconnect; and one or more electronic interconnect, further configured to support a quantum sensor, and methods of operating and fabricating thereof. Further provided is a the interposer containing one or more classical sensors. Further provided is a network of quantum sensors supported by said interposers.
- Date
- 2026
- Authors
- AP Jacob, S Sunder
- Inventors
- Ajey Poovannummoottil Jacob, Sugeet Sunder
- Patent_office
- US
- Application_number
- 19033302